AMD Zen 6 CPUs have been spotted shipping, with rumours hinting at novel 22-core models

New socket, new architecture, multiple TDPs, and a slightly improved iGPU. What's not to like?

AMD’s next-gen Medusa Point processors are slowly revealing their secrets, the latest of which comes from a shipping manifest that sheds some light on the socket and TDP configurations. According to a shipment document spotted by @Olrak29_ on X, AMD is planning at least two TDP classes, believed to be 45W and 28W.

Medusa Point is expected to debut a different method of product segmentation, offering a monolithic die that contains some CPU cores, an IOD, and the iGPU, which can be augmented by a second chiplet featuring additional CPU cores. For instance, the rumoured flagship model is said to pack four Zen 6 cores, four Zen 6c cores, and two Low Power Zen 6 cores, plus another 12 Zen 6 via the second chiplet, for a total of 22 cores. For graphics, the first chiplet should also contain an 8CU RDNA 3.5+ GPU that’s been slightly upgraded.

AMD Medusa Zen 6 chip in shipping manifest.

On the manufacturing side, Medusa Point is expected to leverage the TSMC N3P node for its CPU/IO/GPU combo chiplet, while saving the better N2P process for its second compute-only die. Logically, the package variants that house only one chiplet will target low-power or low-end laptops and handhelds, focusing on battery life and thin designs that hover around 28W TDP.

While AMD already offers configurable TDPs for OEMs, this approach should provide greater flexibility, especially on the lower-power ranges, where big chips struggle below certain thresholds. Add to that the new Low Power cores, and efficiency will be better than ever on a Ryzen processor.

The document also mentions an FP10 part, which seems to refer to the socket selected by AMD. It is said to be a new laptop CPU socket measuring 25mm x 42.5mm, meaning it’s about 6% larger than the FP8 BGA socket used by AMD’s Z1/Z2 series APUs powering Asus and Xbox gaming handhelds.

Until AMD confirms when it plans to debut Medusa Point APUs, the best guess seems to be around 2027, since next-gen Ryzen AI 400 Gorgon Point chips are expected at CES 2026. If you are looking for something better than Strix Halo, you will have to wait another year.

Fahd Temsamani
Fahd Temsamani
Senior Writer at Club386, his love for computers began with an IBM running MS-DOS, and he’s been pushing the limits of technology ever since. Known for his overclocking prowess, Fahd once unlocked an extra 1.1GHz from a humble Pentium E5300 - a feat that cemented his reputation as a master tinkerer. Fluent in English, Arabic, and French, his motto when building a new rig is ‘il ne faut rien laisser au hasard.’

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